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4th Korea-Japan Joint Symposium on
Micro Fabrication


2003.5.29-30
Cheju National University, Training Center

Organized by KITECH
In cooperation with RIKEN
Supported by MOCIE



May 29(Thu)
12:30〜  Registration
13:00〜  Opening Announcement(N.S. Cho, KITECH)
Session1 Chairman: S.I. Oh
13:20〜  Advances in Ultra/Nano Precision Fabrication and Research Activities
H. Ohmori, RIKEN
13:50〜  Shear Behavior of Ceramic Green Sheet in Mechanical Micro Hole Punching
S.I. Oh, Seoul National University
14:20〜  Development of Desk-top Fabrication System with MQL Technique
Y. Uehara, RIKEN
14:50〜  Simulation of Injection Molding and Structural Analysis for Plastic Small Gear
M.Y. Ryu, Seoul National University of Technology
15:20〜  Coffee Break
Session2 Chairman: S.H. Hong
15:30〜  A Study on Micro Mechanical Fabrication by ELID Truing Technique
T. Shimizu, RIKEN
16:00〜  Micro Deep Hole Machining by EDM with Ultrasonic Vibration
Y.S. Lee, Seoul National University(IAMD)
16:30〜  A Study on Injection Molding Technique in Micro Fabrication
T.S. Kwak, RIKEN
17:00〜  Relationship between Mechanical Properties and Micro-Structure of Ultra-fine Wires
S.H. Hong, KAIST
17:30〜  Blazed Diffraction Gratings Fabrication by Nano Precision Machining
S. Morita, RIKEN
18:00〜  Banquet
May 30(Fri)
Session3 Chairman:D.C. Han
09:30〜  Surface Modification Technique by Micro Mechanical Fabrication
K. Katahira, RIKEN
10:00〜  Burrless Punching and Blanking of Thin Sheet with Hydrostatic Pressing
E.Z. Kim, KITECH
10:30〜  Development of Ultra/Nano Precision On-machine Measurement Systems
Y. Watanabe, RIKEN
11:00〜  Rapid Dimensional Passive Rotational Micro Mixer in Microfluidic System
D.C. Han, Seoul National University
11:30〜  Lunch Time



VOL. 1,  VOL. 2,  VOL. 3,  VOL. 4,  VOL. 5, 
VOL. 6,  VOL. 7,  (VOL. 2),  VOL. 8,  VOL. 9, 
(VOL. 3),  VOL. 10,  VOL. 11,  (VOL. 4),  VOL. 12, 
VOL. 13,  VOL. 14,  VOL. 15,  (VOL. 5),  VOL. 16, 
VOL. 17,  VOL. 18,  (VOL. 6),  VOL. 19,  VOL. 20, 
(VOL. 7),  VOL. 21,  (VOL. 8),  VOL. 22,  VOL. 23, 
VOL. 24,  (1st),  (VOL. 9),       



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